Reduce product weight by more than 20% with the Cyient X-Band TR Module, designed using hybrid PCB technology without the need for traditional connectors.
Exercise offset obligations without ITAR restrictions with the Cyient X-Band TR Module that uses pre-screened products requiring moderate qualification.
Increase efficiency and delivery with the Cyient X-Band TR Module that uses off-the-shelf SMD components to enable production in standard reflow SMT PCB assembly line.
Increase efficiency and delivery with the Cyient X-Band TR Module that uses off-the-shelf SMD components to enable production in standard reflow SMT PCB assembly line.
Discover how you can streamline production and qualification processes for TR Modules in AESA RADAR systems.
Given the manufacturing complexities and export control regulations, standard TR Modules available today are extremely expensive. TR Modules are also the building blocks for AESA radars and account for over 33% of normalized system production costs. Addressing these challenges starts at the component level, where the design, development, and qualification processes play a crucial role in system optimization. Conventional designs use chip & wire bond assembly that results in poor yield and high cost of manufacturing. Standard TR Modules also use connectors that increase overall product weight.
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With a 20% reduction in weight, the Cyient X-Band TR Module delivers:
