Designing ASICs for the Future of Healthcare

Trends shaping the most innovative and future-ready medical implants and patches

Watch On-Demand

What shapes the leading medical implants and patches in the market today?

Is it improved power transfers, higher communication data rates, re-chargeable battery operation, security? The need to increase the charging capacity of an implant or securely download data from implant to cloud is a major driver for medtech companies to enhance customer experience and patient convenience.

Key Highlights


Join Jan Crols, CTO of Ansem, and Mayank Maria, Practice Director at Everest Group, as they discuss industry and technical trends shaping the future of ASICs used in medical implants and patches. The session will be moderated by Eugene Agresta, VP & Global Sector Head of the medtech business at Cyient.

Everest Group’s analysis on Engineering R&D spend, key investment areas, and implications on the medical devices industry

Rechargeable Implants: Trends and Complexities of the ASICs

Shaping the ASICS on medical implants for the future with secure communications, new power techniques, computing, memory storage and complex operating sequences.



Jan Crols

CTO, AnSem, A Cyient Company

Jan is responsible for developments of integrated wireless communication circuits and systems, high speed IO’s with serdes technology, high-speed ADC’s and DAC’s and advanced mixed signal ASICs implemented in CMOS technologies ranging from 0.18 µm to 28 nm


Mayank Maria

Practice Director, Everest Group

Mayank Maria is a member of the Engineering Services practice at Everest Group. He assists clients on topics related to engineering spending and outsourcing across key verticals including automotive, hi-tech, industrial, and medical devices.


Eugene Agresta

VP & Global Sector Head, Medical Technology and Healthcare, Cyient

Eugene is responsible for managing and leading a diverse team of business professionals accountable for sales & account management, business development, industry partnerships, engineering, manufacturing, and digital transformation services.